View BD88400FJ-GE2_9014181.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/27 tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 tsz22111 ? 14 ? 001 www.rohm.com datashee t 80-mw coupling capacitorless stereo headphone amplifiers bd88400fj general description bd88400fj is an output coupling capacitorless headphone amplifier. this ic has a built-in regulated negative voltage generator type that generates the direct regulated negative voltage from the supply voltage. it is possible to drive headphones in a ground standard with both voltage of the posit ive voltage (+2.4v) and the negative voltage (-2.4v). therefore a large capacitance output coupling capacitor becomes needless and can reduce cost, board area and height of the part. in addition, there is no si gnal degradation at the low range caused by the output coupling capacitor and output load impedance, thus a rich low tone can be outputted. features ? no bulky dc-blocking capacitors required ? no degradation of low-frequency response due to output capacitors ? ground-referenced outputs ? gain setting: vari able gain with external resistors ? low thd+n ? low supply current ? integrated negative power supply ? integrated short-circuit and thermal-overload protection applications home audio, tvs, portable audio players, pcs, digital cameras, electronic dictio naries, voice recorders, bluetooth headsets, etc. package w(typ) x d(typ) x h(max) key specifications and lineup supply voltage [v ] +2.4 to +5.5 supply current [ma] 2.0 (no signal) gain [v/v] variable gain with external resistor maximum output power [mw] 80 (v dd =3.3v,r l =16 ? , thd+n 1%,f=1khz) thd+n [%] 0.006 (v dd =3.3v,r l =16 ? ,po=10mw,f=1khz) noise voltage [vrms] 10 psrr [db] -80 (f=217hz) sop-j14 8.65mm x 6.00mm x 1.65mm downloaded from: http:///
bd88400fj 2/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical application circuit in bd88400fj, the pass gain follows formula (4). the pass gain and the resistor rf is limited by table.1. i f r r gain = (4) table 1. pass gain and resistor limit item min typ max unit pass gain 0.5 1.0 2.0 v/v rf 1.0 10 - k ? ri - 10 - k ? ri is not limited. but, if this resistor ri is very small, the signal degradation happ ens at the low frequency (refer to formul a (2)). part function value remarks cf flying capacitor 2.2f temp. characteristic class-b ch hold capacitor 2.2f temp. characteristic class-b cpvdd bypass capacitor 1.0f temp. characteristic class-b csvdd bypass capacitor 1.0f temp. characteristic class-b cil coupling capacitor 1.0f temp. characteristic class-b cir coupling capacitor 1.0f temp. characteristic class-b ri input resistor 10k mcr006yzpj103 (rohm) rf feedback resistor 10k mcr006yzpj103 (rohm) downloaded from: http:///
bd88400fj 3/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 pin configuration (top view) pin descriptions no. pin name function symbol 1 shdnrb headphone amplifier (rch) shutdown control (h:active, l:shutdown) e 2 inr headphone amplifier (rch) input c 3 sgnd ground for headphone amplifier - 4 shdnlb headphone amplifier (lch) shutdown control (h:active, l:shutdown) e 5 pvdd positive power supply for charge pump - 6 c1p flying capacitor positive a 7 pgnd ground for charge pump - 8 c1n flying capacitor negative b 9 pvss negative supply voltage output f 10 svss negative supply voltage for signal - 11 outl headphone amplifier (lch) output d 12 svdd ground for headphone amplifier - 13 outr headphone amplifier (rch) output d 14 inl headphone amplifier (lch) input c downloaded from: http:///
bd88400fj 4/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 block diagram downloaded from: http:///
bd88400fj 5/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol rating unit sgnd to pgnd voltage v gg 0.0 v svdd to pvdd voltage v dd -0.3 to +0.3 v svss to pvss voltage v ss 0.0 v sgnd or pgnd to svdd, pvdd voltage (note 1) v dg -0.3 to +6.0 v svss, pvss to sgnd or pgnd voltage v sg -3.5 to +0.3 v sgnd to in_- voltage v in (svss-0.3) to 2.8 v sgnd to out_- voltage v out (svss-0.3) to 2.8 v pgnd to c1p- voltage v c1p (pgnd-0.3) to (pvdd+0.3) v pgnd to c1n- voltage v c1n (pvss-0.3) to (pgnd+0.3) v sgnd to shdn_b- voltage v sh (sgnd-0.3) to (svdd+0.3) v input current i in -10 to +10 ma power dissipation (note 2) pd 1.02 w storage temperature range tstg -55 to +150 c maximum junction temperature tjmax +150 c (note 1) pd must not be exceeded. (note 2) when mounted on 70mm70mm1.6mm fr4, 1-layer glass epoxy board. derate by 8.19mw/c when operating above ta=25c caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol rating unit min typ max supply voltage range v svdd ,v pvdd 2.4 - 5.5 v operating temperature range t opr -40 - +85 c downloaded from: http:///
bd88400fj 6/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics unless otherwise specified, t ta =25c, svdd=pvdd=3.3v, sgnd=pgnd=0v, shdnlb=shdnrb =svdd, cf=ch=2.2f, rl=no load, ri=rf=10k ? parameter symbol limit unit conditions min typ max supply current shutdown supply current i st - 0.1 2 a shdnlb=shdnrb=l quiescent supply current i dd1 - 1.3 - ma (shdnlb,shdnrb)=(h,l) or (l,h), no signal i dd2 - 2.0 7.4 ma shdnlb=shdnrb=h, no signal shdn_b terminal h level input voltage v ih 1.95 - - v l level input voltage v il - - 0.70 v input leak current i leak - - 1 a headphone amplifier shutdown to full operation t son - 80 - s shdnlb=shdnrb=l to h offset voltage v is - 0.5 6.0 mv maximum output power p out 30 60 - mw r l =32 ? , thd+n -40db, f=1khz, 20khz lpf, for single channel 40 80 - mw r l =16 ? , thd+n -40db, f=1khz, 20khz lpf, for single channel total harmonic distortion + noise thd+n - 0.008 0.056 % r l =32 ? , p out =10mw, f=1 khz, 20khz lpf - 0.006 0.100 % r l =16 ? , p out =10mw, f= khz, 20khz lpf gain a v - -1.00 - v/v gain is variable by the external resistor of ri and rf. gain match a v - 1 - % noise v n - 10 - vrms 20khz lpf + jis-a slew rate sr - 0.15 - v/s maximum capacitive load cl - 200 - pf crosstalk ct - -90 - db r l =32 ? , f=1khz, v out =200mv p-p , 1khz bpf power supply rejection ratio psrr - -80 - db f=217hz, 100mv p-p \ ripple, 217hz bpf charge-pump oscillator frequency f osc 200 300 430 khz thermal-shutdown threshold tsd - 145 - c thermal-shutdown hysteresis t hys - 5 - c downloaded from: http:///
bd88400fj 7/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves general items unless otherwise specified, ta =25c, sgnd=pgnd=0v, shdnlb= shdnrb=svdd, cf=ch=2.2f, input coupling capacitor=1f, r l =no load (note) in bd88400fj the input resistor (ri)=10k ? , feedback resistor(rf)=10k ? . figure 1. standby current vs supply voltage 0.1n 1n 10n 100n 1u 0.0 1.0 2.0 3.0 4.0 5.0 6.0 supply voltage [v] standby current [a] shdnlb=0v shdnrb=0v shdnlb=0v shdnrb=0v figure 2. monaural operating current vs supply voltage 0.0 1.0 2.0 3.0 4.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 supply voltage [v] operating current [ma] shdnlb=vdd shdnrb=0v * this caracteristics has hysteresis (40mv typ) by uv lo. shdnlb=v dd shdnrb=0v (note) this characteristics has hysteresis (40mv typ) by uvlo. figure 3. stereo operatin g current vs supply voltage 0.0 1.0 2.0 3.0 4.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 supply voltage [v] operating current [ma] shdnlb=vdd shdnrb=vdd * this caracteristics has hysteresis (40mv typ) by uv lo. shdnlb=v dd shdnrb=v dd (note) this characteristics has hysteresis (40mv typ) b y uvlo. figure 4. negative voltage vs supply voltage -3 -2.5 -2 -1.5 -1 -0.5 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 supply voltage [v] vss voltage [v] shdnlb=vdd shdnrb=vdd no load shdnlb=v dd shdnrb=v dd no load downloaded from: http:///
bd88400fj 8/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued general items figure 7. psrr vs frequency (v dd =2.4v) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 100 1k 10k 100k frequency [hz] psrr [db] vdd=2.4v ripple = 100mvp-p bpf v dd =2.4v ripple=100mvp-p bpf figure 8. psrr vs frequency (v dd =3.3v) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 100 1k 10k 100k frequency [hz] psrr [db] vdd=3.3v ripple = 100mvp-p bpf v dd =3.3v ripple=100mvp-p bpf figure 5. setup time vs supply voltage 0 20 40 60 80 100 120 140 160 180 200 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 supply voltage [v] setup time [us] shdnlb=shdnrb =l->h vss 90% setup time no load setu p time [ s ] shdnlb=shdnrb =l->h v ss 90% setup time no load figure 6. maximum output power vs supply voltage 0 10 20 30 40 50 60 70 80 90 100 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 supply voltage [v] maximum output power [mw] thd+n Q -40db 20khz lpf stereo rl=16 , in phase rl=16 , out of phase rl=32 , out of phase rl=32 , in phase r l =16 ? , in phase r l =16 ? , out of phase r l =32 ? , out of phase r l =32 ? , in phase thd+n -40db 20khz lpf stereo downloaded from: http:///
bd88400fj 9/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued general items figure 9. psrr vs frequency (v dd =5.5v) figure 10. crosstalk vs frequency (v dd =2.4v) figure 11. crosstalk vs frequency (v dd =3.3v) figure 12.crosstalk vs frequency (v dd =5.5v) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 100 1k 10k 100k frequency [hz] psrr [db] vdd=5.5v ripple = 100mvp-p bpf -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 100 1k 10k 100k frequency [hz] cross talk [db] ltor rtol vdd=2.4v vout = 200mvp-p rl=32 bpf -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 100 1k 10k 100k frequency [hz] cross talk [db] ltor rtol vdd=3.3v vout = 200mvp-p rl=32 bpf -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 100 1k 10k 100k frequency [hz] cross talk [db] ltor rtol vdd=5.5v vout = 200mvp-p rl=32 bpf v dd =3.3v v out =200mvp-p r l =32 ? bpf v dd =3.3v v out =200mvp-p r l =32 ? bpf v dd =5.5v ripple=100mvp-p bpf v dd =2.4v v out =200mvp-p r l =32 ? bpf downloaded from: http:///
bd88400fj 10/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued bd88400fj figure 13. output voltage vs input voltage (v dd =3.3v) figure 14. gain vs frequency (v dd =3.3v) figure 15. thd+n vs output power (v dd =3.3v, r l =16 ? ) figure 16. thd+n vs output power (v dd =3.3v, r l =32 ? ) -120 -100 -80 -60 -40 -20 0 -120 -100 -80 -60 -40 -20 0 input voltage [dbv] output voltage [dbv] vdd=3.3v f=1khz bpf rl=32 rl=16 -10 -8 -6 -4 -2 0 2 4 6 8 10 10 100 1k 10k 100k frequency [hz] gain [db] vdd=3.3v, po=10mw ri=10k , input coupling capacitor = 1.0uf rl=32 rl=16 0.001 0.01 0.1 1 10 100 1n 100n 10u 1m 100m output power [w] thd+n [%] vdd=3.3v 20khz-lpf f=1khz stereo rl=16 out of phase in phase 0.001 0.01 0.1 1 10 100 1n 100n 10u 1m 100m output power [w] thd+n [%] vdd=3.3v 20khz-lpf f=1khz stereo rl=32 out of phase in phase v dd =3.3v f=1khz 20khz-lpf bpf r l =32 ? r l =16 ? r l =32 ? r l =16 ? v dd =3.3v 20khz-lpf f=1khz stereo r l =16 ? v dd =3.3v 20khz-lpf f=1khz stereo r l =32 ? v dd =3.3v, po=10mw r i =10k ? , input coupling capacitor=1.0f downloaded from: http:///
bd88400fj 11/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued bd88400fj figure 17. thd+n vs frequency (v dd =3.3v, r l =16 ? ) figure 18. thd+n vs frequency (v dd =3.3v, r l =32 ? ) figure 19. noise spectrum vs frequency (v dd =3.3v) 0.001 0.01 0.1 1 10 100 10 100 1k 10k 100k frequency [hz] thd+n [%] vdd=3.3v rl=16 ? 20khz-lpf stereo (in phase) po=10mw po=1mw po=0.1mw 0.001 0.01 0.1 1 10 100 10 100 1k 10k 100k frequency [hz] thd+n [%] vdd=3.3v rl=32 ? 20khz-lpf stereo (in phase) po=10mw po=1mw po=0.1mw -140 -120 -100 -80 -60 -40 -20 0 10 100 1k 10k 100k frequency [hz] spectrum [dbv] vdd=3.3v input connect to the ground with 1.0uf v dd =3.3v input connect to the ground with 1.0f v dd =3.3v r l =16 ? 20khz-lpf stereo (in phase) v dd =3.3v r l =32 ? 20khz-lpf stereo (in phase) downloaded from: http:///
bd88400fj 12/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 timing chart (usually operation) pv dd,sv dd shdnlb shdnrb pvss,svss inl,inr outl outr shutdow n setup signal output shutdow n amp enable figure 20. usually operation (uvlo operation) a a figure 21. uvlo operation (tsd operation) pv dd, sv dd shdnlb, shdnrb pvss,svss outl outr signal output signal output tsd ta hy steresis = 5 figure 22. tsd operation downloaded from: http:///
bd88400fj 13/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 application information 1. functional descriptions figure 23 shows the conventional headphone amplifier circuit. in this circuit, the signal is outputted using the middle point bias circuit based on the middle point bias. therefore, the output coupling capacitor that removes the dc voltage difference and does the ac coupling is necessary. this coupling capacitor and the impedance of the headphone compose the high-pass filter. therefore, the signal degradation in the low fr equency region is experienced. the output coupling capacitor should be of large capacitance because t he cutoff frequency of this high-pass filter follows formula (1). cl c c r 2 1 f = (1) (note) cc is the coupling capacitor, and r l is the impedance of the headphone. moreover, pop noise by the middle point bias start-up is generated and the degradati on of psrr is experienced. + - vdd gnd + vout input time [s] vout [v] vdd/2 middle point bias circuit vdd 0 vhp 0 vhp [v] time [s] cc figure 23. conventional headphone amplifier circuit figure 24 shows the bd88400fj series circuit. in this ci rcuit, the signal is outputted using a negative voltage based on the ground level. therefore, the amplifier output can be connected directly to the headphone, making the output coupling capacitor unnecessary. in addition, the signal degradation in the low frequency region with the coupling capacitor is not generated, thus a deep bass is achieved. moreover, pop noise is not controlled by the middle point bias start-up. thus, the degr adation of psrr doesn't occur since it is based on the ground. + - hpvdd vout input time [s] vout [v] vdd charge pump vss 0 cf : flying capacitor ch : hold capacitor vhp 0 vhp [v] time [s] hpvdd figure 24.bd88400fj series circuit out v out [v] v out [v] out v hp [v] v hp [v] v hp v hp downloaded from: http:///
bd88400fj 14/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 (1) charge pump / charge pump control the negative power supply circuit is co mposed of the regulated charge-pump . this circuit outputs the regulated negative voltage (pvss) directly from power-supply voltage (pvdd). therefore, it does n't depend on the power-supply voltage and a constant volt age is outputted (pvss=-2.4v @typ , refer to figure 4). moreover, there is no power supply swinging caused by the output current of the headphone amplifier. also, it doesn't influence the headphone amplifier characteristic. figure 25. pvss load current regulation characteristics (reference data) (a) power control the power control is a logical sum of shdnlb and shdnrb. the negative power supply circuit starts when h level is inputted to either shdnlb or shdnrb, and power down when shdnlb=shdnrb=l level. table.2 charge pump control shdnlb shdnrb control l l power down l h power on h l power on h h power on (b) operating frequency the operating frequency of the negative power supply char ge pump is designed to minimize temperature and voltage dependency. figure 26 shows the reference data (measurements). please note the frequency interference in the application board. figure 26. temperature characteristic and voltage charac teristic of operating fr equency (reference data) (c) the flying capacitor and the hold capacitor the flying capacitor (cf) and the hold capacitor (ch) greatly influence the characte ristic of the charge pump. therefore, please connect 2.2f capacitor with an excellent temperature characteristic and voltage characteristic as near as possible to the ic. 200 220 240 260 280 300 320 340 360 380 400 2.0 3.0 4.0 5.0 6.0 supply voltage[v] charge pump ocsillator frequency [khz ] ta=25 measure : c1p cf=ch=2.2uf 200 220 240 260 280 300 320 340 360 380 400 -50.0 0.0 50.0 100.0 ta [ ] charge pump ocsillator frequency [khz ] vdd=3.3v measure : c1p cf=ch=2.2uf v dd =3.3v measure: c1p cf=ch=2.2f ta=25c measure: c1p cf=ch=2.2f temperature : ta [c] supply voltage [v] change pump oscillator frequency [khz] change pump oscillator frequency [khz] a y a [a= = ==] a [] a [] load current [ma] vss voltage [v] vss voltage vs load current [ta=25c, v dd =3.3v, cf=ch=2.2f] downloaded from: http:///
bd88400fj 15/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 (2) headphone amp the headphone amplifier is driven by the internal positive voltage (+2.4v) and negative voltage (svss, -2.4v) based on ground (sgnd). therefore, the headphone can be connected without the out put coupling capacitor. as a result, it brings improvement to low-frequency characteristic comp ared with the conventional coupling capacitor headphone type. (a) power control l channel and r channel of the headphone amplifier can be independently controlled by shdnlb and shdnrb logic. when the svss voltage is -1.1v @typ or more, the headphone amplifier does not operate to protect from illegal operation. in addition, the over-c urrent protection circuit is built in. the amplifier shutdowns when the over-current occurs because of the output short-circui t etc., thus ic is protected from being destroyed. table.3 control of the headphone amplifier shdnlb shdnrb l channel r channel l l power down power down l h power down power on h l power on power down h h power on power on vdd 0 [v] [time] shdnx b 0 [v] [time] svss -1.1v amplif ier en a b le amprilier disable figure 27. area of headphon e amplifier can operate svss does not have internal connection with pvss. pl ease connect svss with pvss on the application board. (b) input coupling capacitor input dc level of bd88400fj is 0v (s gnd). the input coupling capacitor is necessary for the connection with the signal source device. the signal degradation happens in the low frequency becaus e of the high-pass filter composed by this input coupling capacito r and the input impedance of bd88400fj. the input impedance of bd88400fj is external resistance ri. the cutoff frequency of this high-pass filter follows formula (2). in in c c r 2 1 f = (2) where: c in is the input coupling capacitor. r in =ri figure 28. input coupling capacitor frequency response (reference data) -21.0 -18.0 -15.0 -12.0 -9.0 -6.0 -3.0 0.0 3.0 6.0 9.0 1 10 100 frequency [hz] gain [db] rin=14k cin=1uf cin=2.2uf cin=4.7uf cin=10uf r in =14k ? c in =10f c in =4.7f c in =2.2f c in =1f frequency [hz] gain [ db ] downloaded from: http:///
bd88400fj 16/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 the degradation of thd+n happens becaus e of the input coupling capacitor. t herefore, please consider these when selecting components. (note) capacitor size: 1608 figure 29. thd+n by the input coupling capacitor (reference data) (c) terminal state during power down the power control of the headphone amplifier changes t he state of the terminal. when in shutdown, the input impedance of the input terminal becomes 7.1k ? @typ (in bd88400fj, become ri + 7.1k ? ). the time constant can be reduced when the input coupling capacitor is charged. the input voltage changes while charging up the input coupling capacitor. ther efore, do not operate the headphone amplifier while charging. audio source + - vdd vout time [s] vs [v] output bias 0 vss vs vin time [s] vin [v] output bias 0 cin rin =7.1k figure 30. input voltage transition with input coupling capacitor charge time constant follows formula (3) by using the input coupling capacitor and the input impedance. the calculation of the convergence value to wait time is indicated in figure 31. in in c r = (3) (note) r in =7.1k ? @ typ in bd88400fj, r in =ri+7.1k ? figure 31. convergence vs wait time (reference) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 100 1k 10k 100k frequency [hz] thd+n [db] bd88415gul vdd=3.3v po=10mw rl=16 20khz lpf cin=0.22uf cin=0.47uf cin=1.0uf cin=2.2uf 0 10 20 30 40 50 60 70 80 90 100 0 1 2 3 4 5 6 7 8 wait time [s] convergence [%] wait time [s] convergence [%] out vs in c in r in =7.1k ? v in [v] v s [v] thd+n [db] c in =1.0f c in =0.47 c in =0.22 c in =2.2f bd88415gul v dd =3.3v po=10mw r l =16 ? 20khz lpf frequency [hz] downloaded from: http:///
bd88400fj 17/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 (3) uvlo / shutdown control bd88400fj has low voltage protection function (uvlo: under vo ltage lock out). this protects the ic from the illegal operation during a low power supply voltage. the detection voltage is 2.13v @typ , so it does not influence recommended operat ion voltage of 2.4v. uvlo controls the whole ic, and also both the negative power supply char ge pump and the headphone amplifier during power down. (4) tsd bd88400fj has overheating protection function (tsd: the rmal shutdown). the headphone amplifier shutdowns when overheating occurs due to headphone amplifier illegal operation. (the detection temp. 145c @typ ) downloaded from: http:///
bd88400fj 18/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 2. evaluation board bd88400fj evaluation board loads and operates with the necessary parts only. it uses rca connector for input terminal and headphone jack ( =3.5mm) for output terminal. t herefore it can easily conne ct between audio equipment. also, it can operate using a single supply (2.4v to 5.5v). the switch on the board (sdb) can control shutdown. (spec.) item limit unit supply voltage range (vdd) 2.4 to 5.5 v maximum supply current 1.0 a operating temperature range -40 to +85 c input voltage range -2.5 to +2.5 v output voltage ran ge -2.5 to +2.5 v minimum load impedance 15 ? (schematic) figure 32. evaluation board schematic (bd88400fj) downloaded from: http:///
bd88400fj 19/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 (parts list) parts name type value size u1 sop-j14pin bd88400fj 8.65mm x 6.00mm c3, c5 chip ceramic capacitor 2.2f 1608 c1,c2,c4,c6 chip ceramic capacitor 1.0f 1608 c7 tantalum capacitor 10f 3216 r2,r3,r5,r6 chip resistor 10k ? 1608 r7, r8 chip resistor open - cn3 headphone jack - =3.5mm (operation procedure) turn off the switch (shndlb/shdnrb) on evaluation board. connect the positive terminal of the power supply to the vdd pin and ground terminal to the gnd pin. connect the left output of the audio source to the inl and c onnect the right output to the inr. turn on the power supply. turn on the switch (shdnlb/shdnrb) on the evaluation board. (h) input the audio source. downloaded from: http:///
bd88400fj 20/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 (board layout) (top layer - top view) (bottom layer C top view) figure 33. rohm application board layout (bd88400fj) downloaded from: http:///
bd88400fj 21/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 power dissipation figure 34 shows the reference value of the thermal derating curve. (conditions) this value is for mounted on the rohm standard board board size: 70mm x 70mm x 1.6mm (fr4, 1-layer pcb) figure 34. thermal derating curve 0 0.2 0.4 0.6 0.8 1 1.2 0 25 50 75 100 125 150 ta [ ] pd [w] temperature : ta [c] power dissipation : pd [w] downloaded from: http:///
bd88400fj 22/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalent circuits pin6 pin8 pin2,14 pin11,13 pin1,4 pin9 a pad pvdd pvdd pgnd pgnd c pad - + svdd svss d pad - + svss svdd e pad svdd sgnd b pad pvss pvss pgnd pgnd f pad pgnd pgnd downloaded from: http:///
bd88400fj 23/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage except for pins the output of which were designed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trac es, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a ca pacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic durin g assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
bd88400fj 24/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are oft en connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnec ted, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specifi ed, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of th e p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 35. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that th e output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automat ically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 16. over-current protection circuit (ocp) this ic has a built-in overcurrent protecti on circuit that activates when the output is accidentally shorted. however, it is strongly advised not to subject the ic to prolonged shorting of the output. downloaded from: http:///
bd88400fj 25/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 8 8 4 0 0 f j - ge 2 part number package fj: sop-j14 packaging and forming specification ge2: embossed tape and reel marking diagram sop-j14 (top view) bd88400fj part number marking lot number 1pin mark downloaded from: http:///
bd88400fj 26/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name sop-j14 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
bd88400fj 27/27 datasheet datasheet tsz02201-0c1c0ea00160-1-2 ? 2014 rohm co., ltd. all rights reserved. 07.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 26.may.2014 001 new release. 07.aug.2014 002 p.6 electrical characteristics limit : offset voltage max 5.0mv -> 6.0mv downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BD88400FJ-GE2

	To Download BD88400FJ-GE2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .